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【英文标准名称】:Electronicsassemblytechnology-Selectionguidanceofenvironmentalandendurancetestmethodsforsolderjoints
【原文标准名称】:电子组装技术.焊缝用环境和耐久性试验方法的选择指南
【标准号】:IEC/PAS62137-3-2008
【标准状态】:作废
【国别】:国际
【发布日期】:2008-11
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC91
【标准类型】:()
【标准水平】:()
【中文主题词】:弯曲试验;定义;耐久性;电气元件;电气工程;电子工程;电子设备及元件;环境试验;架设(施工作业);温度影响;材料试验;可靠性试验;表面安装设备;软钎焊连接;焊接点;焊锡;表面安装;温度稳定性;试验
【英文主题词】:Bendtesting;Definition;Definitions;Durability;Electricalcomponents;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Environmentaltests;Erecting(constructionoperation);Influenceoftemperature;Materialstesting;Reliabilitytesting;SMD;Solderedjoints;Solderingpoints;Solders;Surfacemounting;Temperaturestability;Testing
【摘要】:Thisguidancedescribestheselectionofanappropriatetestmethodforreliabilitytestofsolderjointsforvariousshapesandtypesofsurfacemountdevices(SMD)andleadeddevices,includingvarioustypesofsoldermaterial.TheregionsofthejointstobetestedareshowninFigure1.Thetestmethodsgivenhereareapplicabletoevaluatethestrengthofjointsofacomponentmountedonprintedwiringboardbutnottotestthemechanicalstrengthofcomponentsthemselves.Thetestconditionsforacceleratedtests(rapidtemperaturechangeandhightemperaturetests)mayexceedthemaximumallowabletemperaturerangeforacomponent.Thelead-freesoldershavedifferentpropertiesfromthoseoftheconventionaltin-leadeutecticsolder.Thereliabilityofsolderedjointsusinglead-freesoldermaybereducedbythecompositionofthesolderused,theshapeofterminalsandsurfacetreatment.ThefactorsaffectingthejointreliabilityusingSn96,5Ag3Cu,5solderareshowninFigure2.Thissolderhasthepropertiesofhighermeltingtemperatureandharderthanthetin-leadeutecticsolderandthesolidisnoteasilydeformed.Consequently,thestressinducedtothejointbecomeshigherthanthetin-leadeutecticsolder.Thesepropertiesmayinducebreakofasolderedjointbyacceleratedtemperaturechanges,ormechanicalstress.
【中国标准分类号】:L04
【国际标准分类号】:31_020;31_190
【页数】:44P.;A4
【正文语种】:英语